Optimizing the production of silicon wafers and semiconductors requires improving the yield of the process. The various acqueous solutions used for cleaning and etching silicon wafers are precise mixtures, and it follows that tight control over their chemical ratios provides a means of closely regulating parameters like etching speed and cleaning efficiency.
Measurement | Solution |
---|---|
hydrogen peroxide | OMA Process Analyzer |
Function | Solution |
---|---|
Sampling | SPA-525 Sampler |
Measurement | Solution |
---|---|
hydrofluoric acid | OMA Process Analyzer |
Measurement | Solution |
---|---|
F2 /Cl2 | OMA Process Analyzer |